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- Prospects for Molecular Electronics
- Reliability and Failure of Electronic Materials and Devices (eBook)
- Reliability and Failure of Electronic Materials and Devices
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
Prospects for Molecular Electronics
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation , mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits. Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates.
Reliability and Failure of Electronic Materials and Devices (eBook)
Titre : R. Abstract : This review paper brings together the most prevalent and important models for reliability failures in semiconductor devices. It gives a explanation of the failure, the failure model s and constraints of the models. Examples are presented showing the application of the models for deriving acceleration factors. Original references are included for each model. Graas, H.
Skip to search form Skip to main content You are currently offline. Some features of the site may not work correctly. DOI: Ohring and J. Ohring , J. Lloyd Published Materials Science, Engineering. This well-established and well-regarded reference work offers unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging.
Embed Size px x x x x This book is printed on acid-free paper. All rights reserved. No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Phone: 44 , Fax: 44 , e-mail: permissions elsevier. The cover image is an artist's rendition of an electrostatic spark discharge event that lasts less than one billionth of a second. This miniature lightning bolt from a charged object can easily damage a semiconductor device.
Download Citation | Reliability and Failure of Electronic Materials and Devices | This chapter introduces the subject of failure modes and mechanisms in electronic materials and devices, simple Request Full-text Paper PDF.
Reliability and Failure of Electronic Materials and Devices
Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.
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Это наш долг. Нравится нам это или нет, но демократию от анархии отделяет не очень-то прочная дверь, и АНБ ее охраняет. Хейл задумчиво кивнул: - Quis custodiet ipsos custodes.
У Танкадо наверняка была при себе копия ключа в тот момент, когда его настигла смерть. И я меньше всего хотел, чтобы кто-нибудь в севильском морге завладел ею. - И вы послали туда Дэвида Беккера? - Сьюзан все еще не могла прийти в. - Он даже не служит у. Стратмор был поражен до глубины души.
Быть может, вы оставите… - Всего на одну минуту. Она в столовой.